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首播

重播

  洛桑联邦理工学院的纳米电子和结构实验室(LANES)今天宣布研发出第一款利用二硫化钼(MoS2)构建的芯片,它相比现有的硅芯片具有更高的效率,并可以减少体积。这种芯片与硅芯片最大的区别在于它可以实现3个原子厚的层但依旧保持稳定的状况,它的抗氧化性更好,且导电性容易被控制,这意味着制造方可以进一步减少晶体管的尺寸并使其速度更快。

  举例来说,它可以让计算机芯片更为紧凑并且可以帮助柔性外表硬件的发展,应用上而言,计算机待机模式进入和退出可以变得更快,但目前尚不清楚这种材质的晶体管和是能够出现在用户的日常生活中。

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channelId 1 1 研究人员正研发二硫化钼晶体管 更坚固性能更高 1 洛桑联邦理工学院的纳米电子和结构实验室(LANES)今天宣布研发出第一款利用二硫化钼(MoS2)构建的芯片,它相比现有的硅芯片具有更高的效率,并可以减少体积